Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
- Xiaoxiong Gu
- Joel Silberman
- et al.
- 2012
- EPEPS 2012
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.