Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
2 results for Yiping Yao
Flowable Chemical Vapor Deposition of Lightly Porous Low k SiCOH Dielectrics—Remote Plasma Deposition Processing, Film Analysis and Gap-Fill Application in Nano Device Fabrication
- Son Nguyen
- Thomas Haigh
- et al.
- 2022
- MRS Fall Meeting 2022