Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
2 results for Qingyun Yang
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- John M. Papalia
- Devi Koty
- et al.
- 2022
- SPIE Advanced Lithography 2022