Single-step deep reactive ion etch of silicon for through-via applications with alternative gas mixtures
- Richa Agrawal
- Nathan Marchack
- et al.
- 2025
- Journal of Vacuum Science and Technology A Vacuum Surfaces and Films
Publications
3 results for Qingyun Yang
Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- John M. Papalia
- Devi Koty
- et al.
- 2022
- SPIE Advanced Lithography 2022