Publications

5 results for Divya Taneja

Self-Alignment of Active Si Bridge using Solder Joint Capillary Forces
- - Thomas Lesueur
  - David Danovitch
  - et al.
- 2025
- ECTC 2025
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- - Divya Taneja
  - Jonathan Grenier
  - et al.
- 2024
- ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2024
- ECTC 2024
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- - Prabudhya Roy Chowdhury
  - Katsuyuki Sakuma
  - et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- - Akihiro Horibe
  - Takahito Watanabe
  - et al.
- 2022
- ECTC 2022