Ruthenium interconnect resistivity and reliability at 48 nm pitchXunyuan ZhangHuai Huanget al.2016IITC/AMC 2016
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodesTakeshi NogamiBenjamin D. Briggset al.2015IEDM 2015