Cooling of next generation computer chips: Parametric study for single- and two-phase cooling
- Yassir Madhour
- Severin Zimmermann
- et al.
- 2011
- THERMINIC 2011
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201 results for Bruno Michel
Formulation of percolating thermal underfill by sequential convective gap filling
- Thomas Brunschwiler
- Javier V. Goicochea
- et al.
- 2011
- ISHVAC 2011
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2011
- SEMI-THERM 2011
Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces
- Javier V. Goicochea
- Bruno Michel
- 2011
- SEMI-THERM 2011
Performance of thermal interface materials: Numerical analysis
- Javier V. Goicochea
- Werner Escher
- et al.
- 2010
- THERMINIC 2010
Two-phase flow boiling of R134a in a multimicrochannel heat sink for microprocessor cooling
- Yassir Madhour
- Jonathan Olivier
- et al.
- 2010
- THERMINIC 2010
Advanced liquid cooling for concentrated photovoltaic electro-thermal co-generation
- Werner Escher
- Rami Ghannam
- et al.
- 2010
- THETA 2010
Direct waste heat utilization from liquid-cooled supercomputers
- 2010
- IHTC 2010
Surface functionalization mechanisms of enhancing heat transfer at solid-liquid interfaces
- Ming Hu
- Javier V. Goicochea
- et al.
- 2010
- IHTC 2010
Molecular dynamics simulations of oblique phonon scattering at semiconductor interfaces
- Javier V. Goicochea
- Bruno Michel
- et al.
- 2010
- THETA 2010