3D integrated water cooling of a composite multilayer stack of chips
- Fabio Alfieri
- Manish K. Tiwari
- et al.
- 2010
- IHTC 2010
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201 results for Bruno Michel
Heat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Phonon relaxation times of germanium determined by molecular dynamics at 1000 K
- Javier V. Goicochea
- Bruno Michel
- 2010
- SEMI-THERM 2010
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- Ayse K. Coskun
- David Atienza
- et al.
- 2010
- DATE 2010
Hotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- T. Brunschwiler
- S. Paredes
- et al.
- 2009
- 3DIC 2009
Effect of inlet orifice on saturated CHF and flow visualization in multi-microchannel heat sinks
- Jung Eung Park
- John R. Thome
- et al.
- 2009
- SEMI-THERM 2009
Flow-induced spatial non-uniformity and anisotropy in electrically conductive adhesives
- Brian Smith
- Alexander Bonetti
- et al.
- 2009
- SEMI-THERM 2009
Recent progress of thermal interface material research - an overview
- Johan Liu
- Bruno Michel
- et al.
- 2008
- THERMINIC 2008
Radially oscillating flow hybrid cooling system for low profile electronics applications
- R. Wälchli
- R. Linderman
- et al.
- 2008
- SEMI-THERM 2008