Design of thermal interfaces with embedded microchannels to control bond line formation
- Brian Smith
- Hugo Rothuizen
- et al.
- 2008
- ITherm 2008
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201 results for Bruno Michel
Forced convective interlayer cooling in vertically integrated packages
- 2008
- ITherm 2008
High-performance thermal interface technology overview
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Utility of transient testing to characterize thermal interface materials
- B. Smith
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- SEMI-THERM 2007
Direct liquid jet-impingement cooling with micronsized nozzle array and distributed return architecture
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2006
- ITherm 2006
Microchip cooling module based on FC72 slot jet arrays without cross-flow
- M. Fabbri
- A. Wetter
- et al.
- 2006
- SEMI-THERM 2006
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
- T. Brunschwiler
- U. Kloter
- et al.
- 2005
- SEMI-THERM 2005
High-resolution patterning and transfer of thin PDMS films: FABRICATION of hybrid self-sealing 3D microfluidic systems
- U. Kloter
- H. Schmid
- et al.
- 2004
- MEMS 2004
Selective wet-etching of microcontact-printed Cu substrates with control over the etch profile
- M. Geissler
- H. Schmid
- et al.
- 2003
- Microelectronic Engineering