Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
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3 results for Cyril Cabral
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Silicon Device-Based Sensing for Sustainability
- Sufi Zafar
- Thomas Picunko
- et al.
- 2023
- IEDM 2023