Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.