Self-Alignment of active Si Bridge using solder joint capillary forces
- Thomas Lesueur
- David Danovitch
- et al.
- 2025
- ECTC 2025
Publications
5 results for Dominique Drouin
Analog Conductive-Metal-Oxide/HfOx ReRAM Devices - BEOL Integration, Characterization and Modelling
- 2024
- MRS Fall Meeting 2024
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023