A high-speed, high-sensitivity silicon lateral trench photodetector
- Min Yang
- Kern Rim
- et al.
- 2002
- IEEE Electron Device Letters
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162 results for Daniel M. Kuchta
Progress of High-speed VCSELs and VCSEL-based Co-Packaging for Short Reach Communications
- Daniel M. Kuchta
- 2023
- CLEO 2023
Developments of VCSEL-based transceivers for Co-Packaging
- Daniel M. Kuchta
- 2023
- OFC 2023
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Intra-node High-performance Computing Network Architecture with Fast Optical Switch Fabrics
- Pavlos Maniotis
- Nicolas Dupuis
- et al.
- 2022
- OECC/PSC 2022
Co-packaged optics for HPC and data center networks
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2021
- SPIE OPTO 2021
Scaling HPC Networks with Co-Packaged Optics
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2020
- OFC 2020
High Speed VCSELs and Co-Packaging for Short Reach Communication within Cloud and High Performance Computing
- Daniel M. Kuchta
- 2019
- MOC 2019
Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)
- Daniel M. Kuchta
- Jonathan E. Proesel
- et al.
- 2019
- OFC 2019