Publications

2 results for Nick Polomoff

AFM Assisted Hybrid Bonding Interface Optimization
- - Nick Polomoff
  - Jennifer Fullam
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2024
- IEDM 2024