Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Zerey
- Alina Bennett-dubin
- et al.
- 2025
- ECTC 2025
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4 results for Nick Polomoff
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
AFM Assisted Hybrid Bonding Interface Optimization
- Nick Polomoff
- Jennifer Fullam
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024