Metallization opportunities and challenges for future back-end-of-the-line technology
- Cyril Cabral Jr.
- Benjamin Fletcher
- et al.
- 2010
- ADMETA 2010
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162 results for Cyril Cabral
Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
- K.N. Chen
- Cyril Cabral Jr.
- et al.
- 2010
- VLSI-TSA 2010
CVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Irreversible altering of crystalline phase of phase-change Ge-Sb thin films
- Lia Krusin-Elbaum
- D. Shakhvorostov
- et al.
- 2010
- Applied Physics Letters
Trigate 6T SRAM scaling to 0.06 μm2
- M. Guillorn
- J. Chang
- et al.
- 2009
- IEDM 2009
Towards routine backside SIMS sample preparation for efficient support of advanced IC process development
- M. Hopstaken
- C. Cabral Jr.
- et al.
- 2009
- FCMN 2009
Evidence for electronic gap-driven metal-semiconductor transition in phase-change materials
- Dmitry Shakhvorostov
- Razvan A. Nistor
- et al.
- 2009
- PNAS
Phase transitions in Ge-Sb phase change materials
- Simone Raoux
- Cyril Cabral
- et al.
- 2009
- Journal of Applied Physics