Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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55 results for Paul Andry

2.5D and 3D technology challenges and test vehicle demonstrations
- - John Knickerbocker
  - Paul Andry
  - et al.
- 2012
- ECTC 2012
3D copper TSV integration, testing and reliability
- - Mukta Farooq
  - T. Graves-Abe
  - et al.
- 2011
- IEDM 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- - Paul Andry
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Novel adhesive development for CMOS-compatible thin wafer handling
- - K. Tamura
  - K. Nakada
  - et al.
- 2010
- ECTC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- MRS Fall Meeting 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- - Steven L. Wright
  - Paul S. Andry
  - et al.
- 2008
- ECTC 2008