Rinse additives for defect suppression in 193 nm and 248 nm lithography
- Spyridon Skordas
- Ryan L. Burns
- et al.
- 2004
- Microlithography 2004
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31 results for Sean Burns
Rinse additives for line edge roughness control in 193 nm lithography
- Dario L. Goldfarb
- Sean D. Burns
- et al.
- 2004
- Microlithography 2004
Mesoscale modeling for SFIL simulating polymerization kinetics and densification
- Ryan L. Burns
- Stephen C. Johnson
- et al.
- 2004
- Microlithography 2004
Graded spin-on organic bottom antireflective coating for high na immersion lithography
- Dario L. Goldfarb
- Libor Vyklicky
- et al.
- 2008
- J. Photopolym. Sci. Tech.
Trilayer development for 193 nm immersion lithography
- Sean Burns
- Martin Burkhardt
- et al.
- 2007
- J. Photopolym. Sci. Tech.
Bilayer resists for 193 nm lithography: SSQ and POSS
- Hiroshi Ito
- Hoa D. Truong
- et al.
- 2006
- J. Photopolym. Sci. Tech.
Positive resists based on non-polymeric macromolecules
- Ratnam Sooriyakumaran
- Hoa Truong
- et al.
- 2005
- J. Photopolym. Sci. Tech.
Characterization and lithographic performance of silsesquioxane 193 nm bilayer resists
- Hiroshi Ito
- Hoa D. Truong
- et al.
- 2005
- J. Photopolym. Sci. Tech.
ArF excimer laser resists based on fluoroalcohol
- Hiroshi Ito
- H.D. Truong
- et al.
- 2006
- Polymers for Advanced Technologies
The effect of humidity on deprotection kinetics in chemically amplified resists
- Sean D. Burns
- David R. Medeiros
- et al.
- 2002
- Proceedings of SPIE-The International Society for Optical Engineering