Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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9 results for Yassir Madhour

Investigation of novel solder patterns for power delivery and heat removal support
- - Thomas Brunschwiler
  - Yassir Madhour
  - et al.
- 2013
- ECTC 2013
Wafer-level integration of embedded cooling approaches
- - Stephan Paredes
  - Yassir Madhour
  - et al.
- 2014
- ISSWB 2014
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- - Yassir Madhour
  - Michael Zervas
  - et al.
- 2013
- 3DIC 2013
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- - Arvind Sridhar
  - Yassir Madhour
  - et al.
- 2013
- ICCAD 2013
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- - Yassir Madhour
  - Thomas Brunschwiler
  - et al.
- 2012
- ICEPT 2012
Cooling of next generation computer chips: Parametric study for single- and two-phase cooling
- - Yassir Madhour
  - Severin Zimmermann
  - et al.
- 2011
- THERMINIC 2011
Two-phase flow boiling of R134a in a multimicrochannel heat sink for microprocessor cooling
- - Yassir Madhour
  - Jonathan Olivier
  - et al.
- 2010
- THERMINIC 2010
Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- - Yassir Madhour
  - Brian P. D'Entremont
  - et al.
- 2014
- ASME Journal of Electronic Packaging
Flow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
- - Yassir Madhour
  - Jonathan Olivier
  - et al.
- 2011
- IEEE Transactions on CPMT