Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Publications
6 results for Peter Brofman
Time, temperature, and mechanical fatigue dependence on underfill adhesion
- Joseph Cremaldi
- Michael Gaynes
- et al.
- 2014
- ECTC 2014
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
Polyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Designs of Low Stress I/O Pin Attach Structures
- D.Y. Shih
- P. Palmateer
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology