Pre-applied inter chip fill for 3D-IC joining
- Yasuhiro Kawase
- Makoto Ikemoto
- et al.
- 2014
- IMAPS 2014
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3 results for Yasuhiro Kawase
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- SEMI-THERM 2014
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013