Contact local CD uniformity optimization through etch shrink
- Eric Miller
- Junling Sun
- et al.
- 2021
- SPIE Advanced Lithography 2021
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8 results for Angelique Raley
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- SPIE Advanced Lithography 2017
Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement
- Katie Lutker-Lee
- Jennifer Church
- et al.
- 2022
- Journal of Vacuum Science and Technology B
In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization
- Xinghua Sun
- Yann Mignot
- et al.
- 2022
- Journal of Vacuum Science and Technology B
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS