Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
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70 results for Griselda Bonilla
A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
Electromigration: Void dynamics
- C. Witt
- V. Calero
- et al.
- 2016
- IEEE T-DMR
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials
Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects
- Juan Borja
- Joel L. Plawsky
- et al.
- 2014
- JVSTA
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- C.-K. Hu
- J. Ohm
- et al.
- 2012
- Journal of Applied Physics
Delayed mechanical failure of the under-bump interconnects by bump shearing
- Han Li
- Thomas M. Shaw
- et al.
- 2012
- Journal of Applied Physics
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
- E. Todd Ryan
- Jeremy Martin
- et al.
- 2007
- JES