Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- Takeshi Nogami
- Raghuveer Patlolla
- et al.
- 2017
- IITC 2017
Publications
59 results for Son Van Nguyen
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
Air spacer for 10nm FinFET CMOS and beyond
- K. Cheng
- C. Park
- et al.
- 2016
- IEDM 2016
Tailoring capping layers to reduce stress gradients in copper metallization
- Conal E. Murray
- Deepika Priyadarshini
- et al.
- 2016
- Applied Physics Letters
BEOL dielectric processing for Cu-Low k nano interconnect-impact of plasma CVD initial transient phenomena (ITP)
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2016
- PRiME/ECS Meeting 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016