Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
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55 results for Son Van Nguyen
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials
Improved Air Spacer for Highly Scaled CMOS Technology
- Kangguo Cheng
- Chanro Park
- et al.
- 2020
- IEEE Transactions on Electron Devices
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
Tailoring capping layers to reduce stress gradients in copper metallization
- Conal E. Murray
- Deepika Priyadarshini
- et al.
- 2016
- Applied Physics Letters
Linking strain anisotropy and plasticity in copper metallization
- Conal E. Murray
- Jean L. Jordan-Sweet
- et al.
- 2015
- Applied Physics Letters
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects - State of the art
- Alfred Grill
- Stephen M. Gates
- et al.
- 2014
- Applied Physics Reviews
CVD of fluorosilicate glass for ULSI applications
- M.J. Shapiro
- S. Nguyen
- et al.
- 1995
- Thin Solid Films