Publications

2 results for Brian Quinlan

Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- - Divya Taneja
  - Jonathan Grenier
  - et al.
- 2024
- ECTC 2024
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023