Electrical analysis of interconnections in a solid-state circuit environment
- A.E. Ruehli
- 1972
- ISSCC 1972
Publications
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119 results for Albert E. Ruehli
Capacitance Models for Integrated Circuit Metallization Wires
- Albert E. Ruehli
- Pierce A. Brennan
- 1975
- IEEE JSSC
Accurate Metallization Capacitances for Integrated Circuits and Packages
- Albert E. Ruehli
- Pierce A. Brennan
- 1973
- IEEE JSSC
Validation and application of physics-based via models to dense via arrays
- Xiaoxiong Gu
- Young Kwark
- et al.
- 2011
- DesignCon 2011
Fast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010
On adding metalization to improve via performance on PCBs
- Albert E. Ruehli
- Xiaoxiong Gu
- et al.
- 2009
- EPEPS 2009
Solver for current source type driver(s) and interconnect with linear or nonlinear loads
- Albert E. Ruehli
- Jerry Hayes
- 2009
- EPEPS 2009
Nonlinear circuit solver with linear interconnect load
- Albert E. Ruehli
- Jerry Hayes
- 2008
- EPEPS 2008
Impedance design for multi-layered vias
- Xiaoxiong Gu
- Albert E. Ruehli
- et al.
- 2008
- EPEPS 2008
Electromagnetic compatibility modeling techniques: Past, present and future
- Albert E. Ruehli
- Ekkehard Miersch
- 2008
- APEMC 2008