Power delivery modeling for 3D systems with non-uniform TSV distributionHuanyu HeZheng Xuet al.2013ECTC 2013
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networksZheng XuXiaoxiong Guet al.2012ECTC 2012
Electromagnetic-SPICE modeling and analysis of 3D power networkZheng XuJian-Qiang Luet al.2011ECTC 2011
TSV density impact on 3D power delivery with high aspect ratio TSVsHuanyu HeJames J.-Q. Luet al.2013ASMC 2013
Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packagingZheng XuXiaoxiong Guet al.2011ASMC 2011