Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
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3 results for Joseph Ross
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Grenier
- et al.
- 2024
- ECTC 2024
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013