The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
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Processing dependent thermal conductivity of nanoporous silica xerogel films
- Anurag Jain
- Svetlana Rogojevic
- et al.
- 2002
- Journal of Applied Physics
Porous silica materials as low-k dielectrics for electronic and optical interconnects
- A. Jain
- S. Rogojevic
- et al.
- 2001
- Thin Solid Films