The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
23 results for Shom Ponoth
Processing dependent thermal conductivity of nanoporous silica xerogel films
- Anurag Jain
- Svetlana Rogojevic
- et al.
- 2002
- Journal of Applied Physics
Porous silica materials as low-k dielectrics for electronic and optical interconnects
- A. Jain
- S. Rogojevic
- et al.
- 2001
- Thin Solid Films