Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- Klaus Ruhmer
- David Hawken
- et al.
- 2008
- GBC 2008
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3 results for J. A. Busby
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
The IBM 4769 Cryptographic Coprocessor
- J. A. Busby
- E. N. Cohen
- et al.
- 2020
- IBM J. Res. Dev