Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- Klaus Ruhmer
- David Hawken
- et al.
- 2008
- GBC 2008
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
3 results for J. A. Busby
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
The IBM 4769 Cryptographic Coprocessor
- J. A. Busby
- E. N. Cohen
- et al.
- 2020
- IBM J. Res. Dev