Reactive ion Etching of Silicon and Silicon Dioxide in CF4 Plasmas Containing H2 or C2F4 Additives
- J.P. Simko
- 2019
- JES
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117 results for Gottlieb S. Oehrlein
Removal of Fluorocarbon Residues on CF4/H2 Reactive-ion-Etched Silicon Surfaces Using a Hydrogen Plasma
- J. Simko
- G.S. Oehrlein
- et al.
- 2019
- JES
Selective dry etching of germanium with respect to silicon and vice versa
- G.S. Oehrlein
- T.D. Bestwick
- et al.
- 2019
- JES
Principal Component Analysis of Optical Emission Spectroscopy and Mass Spectrometry: Application to Reactive Ion Etch Process Parameter Estimation Using Neural Networks
- Reza Shadmehr
- David Angell
- et al.
- 2019
- JES
Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: A physics and chemistry perspective
- Kenji Ishikawa
- Tatsuo Ishijima
- et al.
- 2019
- Japanese Journal of Applied Physics
Achieving ultrahigh etching selectivity of SiO2 over Si3N4 and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursors
- Kang Yi Lin
- Chen Li
- et al.
- 2018
- JVSTA
Polymer etching by atmospheric-pressure plasma jet and surface micro-discharge sources: Activation energy analysis and etching directionality
- Andrew J. Knoll
- Pingshan Luan
- et al.
- 2018
- Plasma Processes and Polymers
Fluorocarbon assisted atomic layer etching of SiO2 and Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
- Dominik Metzler
- Chen Li
- et al.
- 2016
- JVSTA
Application of cyclic fluorocarbon/argon discharges to device patterning
- Dominik Metzler
- Kishore Uppireddi
- et al.
- 2016
- JVSTA
Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
- Dominik Metzler
- Robert L. Bruce
- et al.
- 2013
- JVSTA