Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
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5 results for Keisuke Uenishi
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMPACT 2011