Novel Cu reflow seed process for Cu/low-k 64nm pitch dual damascene interconnects and beyond
- K. Motoyama
- Oscar Van der Straten
- et al.
- 2012
- IITC 2012
Publications
Date
Featured collections
Popular topics
4 results for H. Tomizawa
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Optimization of pitch-split double patterning phoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- ASMC 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011