Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.