Publications

2 results for Hiroshi Suzuki

High performance wafer level underfill material with high filler loading
- - Satoru Katsurayama
  - Hiroshi Suzuki
  - et al.
- 2011
- ECTC 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011