64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
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Robust and low cost copper contact application for low power device at 32 nm-node and beyond
- Atsunobu Isobayashi
- James J. Kelly
- et al.
- 2009
- IITC 2009