Design intent optimization at the beyond 7nm node: The intersection of DTCO and EUVL stochastic mitigation techniques
- Michael Crouse
- L. Liebmann
- et al.
- 2017
- SPIE Advanced Lithography 2017
Publications
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38 results for Nicole Saulnier
An OCD perspective of line edge and line width roughness metrology
- Ravi Bonam
- R. Muthinti
- et al.
- 2017
- SPIE Advanced Lithography 2017
Single-expose patterning development for EUV lithography
- Anuja De Silva
- Karen Petrillo
- et al.
- 2017
- SPIE Advanced Lithography 2017
Comprehensive analysis of line-edge and line-width roughness for EUV lithography
- Ravi Bonam
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016
EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Comparison of left and right side line edge roughness in lithography
- Lei Sun
- Nicole Saulnier
- et al.
- 2016
- SPIE Advanced Lithography 2016
Towards production ready processing with a state-of-the-art EUV cluster
- Karen Petrillo
- Nicole Saulnier
- et al.
- 2015
- SPIE Advanced Lithography 2015
EUV processing and characterization for BEOL
- Nicole Saulnier
- Yongan Xu
- et al.
- 2015
- SPIE Advanced Lithography 2015
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012