Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
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10 results for Lili Deligianni
Silicon-on-insulator MOSFETs with hybrid crystal orientations
- M. Yang
- K.K. Chan
- et al.
- 2006
- VLSI Technology 2006
Lower resistance scaled metal contacts to silicide for advanced CMOS
- A. Topol
- C. Sheraw
- et al.
- 2006
- VLSI Technology 2006
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Integration of direct plating of Cu onto a CVD Ru liner
- S. Malhotra
- D. Canaperi
- et al.
- 2004
- AMC 2004
Electrodeposition of indium on copper for CIS and CIGS solar cell applications
- Q. Huang
- Kathleen B. Reuter
- et al.
- 2011
- JES
The next frontier: Electrodeposition for solar cell fabrication
- Lili Deligianni
- Shafaat Ahmed
- et al.
- 2011
- Electrochemical Society Interface
Electrochemical characterization of thin film electrodes toward developing a DNA transistor
- Stefan Harrer
- Shafaat Ahmed
- et al.
- 2010
- Langmuir
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering