Underfill acceleration factor based on thermal fatigue crack growth rate
- Soojae Park
- Claudius Feger
- et al.
- 2010
- ECTC 2010
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5 results for Ijeoma Nnebe
Direct measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
Power cycling effects on the structural stability of thermal pastes used in microelectronics
- Ijeoma Nnebe
- Claudius Feger
- et al.
- 2006
- MRS Fall Meeting 2006
Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2011
- IEEE Transactions on CPMT
Drainage-induced dry-out of thermal greases
- Ijeoma M. Nnebe
- Claudiu Feger
- 2008
- IEEE Transactions on Advanced Packaging