A study on crosstalk analysis in aggregative transmission lines with turning vias
- Tapobrata Bandyopadhyay
- Lei Shan
- et al.
- 2009
- ECTC 2009
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3 results for Tapobrata Bandyopadhyay
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
- Tapobrata Bandyopadhyay
- Ki Jin Han
- et al.
- 2011
- IEEE Transactions on CPMT
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- Ki Jin Han
- Madhavan Swaminathan
- et al.
- 2010
- IEEE Transactions on Advanced Packaging