Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010
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5 results for Leung Tsang
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2009
- EPEPS 2009
Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects
- Boping Wu
- Xiaoxiong Gu
- et al.
- 2011
- Microwave and Optical Technology Letters
Random rough surface effects on wave propagation in interconnects
- Leung Tsang
- Henning Braunisch
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Full-wave solver for microstrip trace and through-hole via in layered media
- Chong-Jin Ong
- Boping Wu
- et al.
- 2008
- IEEE Transactions on Advanced Packaging