Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- John Torok
- Shawn Canfield
- et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
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Using in situ capacitance measurements to monitor the stability of thermal interface materials in complex PCB assemblies
- Michael Gaynes
- Timothy Chainer
- et al.
- 2010
- IMAPS 2010