Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
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13 results for C. Dziobkowski
Cleans for Al vias in a 0.175 μm Dual Damascene Process
- J.P. Gambino
- L. Clevenger
- et al.
- 1999
- IITC 1999
Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures
- E. Liniger
- C. Dziobkowski
- 2006
- Thin Solid Films