A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
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Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010