Publications

3 results for Calvin R. King Jr.

Integrated microfluidic cooling and interconnects for 2D and 3D chips
- - Bing Dang
  - Muhannad S. Bakir
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
3D stacking of chips with electrical and microfluidic I/O interconnects
- - Calvin R. King Jr.
  - Deepak Sekar
  - et al.
- 2008
- ECTC 2008
A 3D-IC technology with integrated microchannel cooling
- - Deepak Sekar
  - Calvin King
  - et al.
- 2008
- IITC 2008