Relationship between substrate bias and microstructure in magnetron-sputtered AlCu filmsT. LinK.Y. Ahnet al.1987Thin Solid Films
Effects of substrate temperature on copper distribution, resistivity, and microstructure in magnetron-sputtered Al-Cu filmsK.Y. AhnT. Linet al.1987Thin Solid Films
Transport in refractory metals and their interaction with SiO2: Comparison of tungsten and molybdenumL. Krusin-ElbaumM.O. Aboelfotohet al.1987Thin Solid Films
A comparison of tungsten film deposition techniques for very large scale integration technologyK.Y. Ahn1987Thin Solid Films
Properties of reactively sputtered tungsten films in nitrogen and oxygenK.Y. AhnS.B. Brodskvet al.1986JVSTA
Effects of deposition methods on the temperature-dependent resistivity of tunasten filmsL. Krusin-ElbaumK.Y. Ahnet al.1986JVSTA
Stress modification of WSi2.2 films by concurrent low energy ion bombardment during alloy evaporationD.S. YeeJ. Floroet al.1985JVSTA
Formation of TiSi2 and TiN during nitrogen annealing of magnetron sputtered Ti filmsE.D. AdamsK.Y. Ahnet al.1985JVSTA
Effects of biased cosputtering on resistivity and step coverage in tungsten silicide filmsK.W. ChoiK.Y. Ahn1985JVSTA