Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
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25 results for Paul Fortier
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Advances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2020
- IEEE JSTQE
Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing
- Tymon Barwicz
- Bo Peng
- et al.
- 2019
- IEEE JSTQE
Automated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology