Patterning of poly-para-xylylenes by reactive ion etching
- J.T.C. Yeh
- K.R. Grebe
- 1983
- JVSTA
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Packaging Technology for Josephson Integrated Circuits
- Syamal K. Lahiri
- H. Randall Bickford
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology