BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016
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16 results for S. Siddiqui
Tungsten and cobalt metallization: A material study for MOL local interconnects
- Vimal Kamineni
- Mark Raymond
- et al.
- 2016
- IITC/AMC 2016
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- T. Dalton
- N. Fuller
- et al.
- 2004
- IITC 2004
High quality interfacial layer formation for Si0.75Ge0.25 (100) high-k metal gate stack
- S. Siddiqui
- R. Galatage
- et al.
- 2020
- Microelectronic Engineering
Impact of surface preparation for n-type Si:P and p-type SiGe:B semiconductors on low resistance silicide contacts
- A. Carr
- B. Peethala
- et al.
- 2017
- Microelectronic Engineering
Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures
- B. Peethala
- F. Mont
- et al.
- 2016
- Microelectronic Engineering