On the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Publications
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- AI Hardware
225 results for AI Hardware
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2023
- iTHERM 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
Acceleration of Decision-Tree Ensemble Models on the IBM Telum Processor
- Nikolaos Papandreou
- Jan Van Lunteren
- et al.
- 2023
- ISCAS 2023
Architectures and Circuits for Analog-memory-based Hardware Accelerators for Deep Neural Networks
- Sidney Tsai
- Pritish Narayanan
- et al.
- 2023
- ISCAS 2023
Physical modeling and design rules of analog Conductive Metal Oxide-HfO2 ReRAM
- Donato Francesco Falcone
- Stephan Menzel
- et al.
- 2023
- IMW 2023
Stochastic magnetic tunnel junction with easy-plane dominant anisotropy
- Jonathan Z. Sun
- Christopher Safranski
- et al.
- 2023
- Physical Review B
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023