Co capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
Publications
14341 results for Physical Sciences
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
Evolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
Investigation of inter-diffusion in bilayer GeTe/SnSe phase change memory films
- Archana Devasia
- David MacMahon
- et al.
- 2012
- Thin Solid Films
Ordered nanopillar structured electrodes for depleted bulk heterojunction colloidal quantum dot solar cells
- Illan J. Kramer
- David Zhitomirsky
- et al.
- 2012
- Advanced Materials
Twin problems of interfacial carbonate formation in nonaqueous Li-O 2 batteries
- Bryan D. McCloskey
- Angela Speidel
- et al.
- 2012
- Journal of Physical Chemistry Letters
Physical characterization of sub-32-nm semiconductor materials and processes using advanced ion beam-based analytical techniques
- M. Hopstaken
- D. Pfeiffer
- et al.
- 2012
- Surface and Interface Analysis
Multicore fiber link demonstrating large bandwidth density for future multimode optical interconnects
- Benjamin G. Lee
- Christian Baks
- et al.
- 2012
- Proceedings of SPIE - The International Society for Optical Engineering 2012